Multi Layer Cu/Mo Clad Metal for LED Epi Wafer Substrate

Super CMC/MCM Multi Layer Cu/Mo Clad Metal for LED Epi Wafer Substrate High Thermal Conductivity : 200~350w/mk Low Thermal Expansion : 6~10ppm/℃ Thickness :≧90μm Application: LED Epi Wafer Substrate , etc. Introduction: Our newly developed Clad material is built-up with multi-layers of Cu and Mo. By changing the thickness of Cu foil and Mo foil, […]

LED Epiweafer on CMC substrate